Cho-Bond 584-208 Epoxy Adhesive in various sizes
P/N:
Cho-Bond 584-208 Epoxy Adhesive in various sizes
Adhesive offers exceptional ease of application for circuit board repair. It is a two- component system with a 1:1 mix ratio, and cures in 24 hours at room temperature. With a 0.75 hour elevated cure temperature of 212F (100C), the material offers volume resistivity of 0.005 ohm-cm.
Cho-Bond 584-208 Epoxy Adhesive in various sizes, Adhesive offers exceptional ease of application for circuit board repair. It is a two- component system with a 1:1 mix ratio, and cures in 24 hours at room temperature. With a 0.75 hour elevated cure temperature of 212F (100C), the material offers volume resistivity of 0.005 ohm-cm.
| Large Part Description | Adhesive offers exceptional ease of application for circuit board repair. It is a two- component system with a 1:1 mix ratio, and cures in 24 hours at room temperature. With a 0.75 hour elevated cure temperature of 212F (100C), the material offers volume resistivity of 0.005 ohm-cm. |
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| Part Number | Cho-Bond 584-208 Epoxy Adhesive in various sizes |
| Featured Brands | PARKER-HANNIFIN CORP-CHOMERICS DIV |